M.Tech (VLSI)

(To be applicable from July 2013-batch onwards)

 

Semester I

Code

Course Name

L–T-P

Credit

EE 502

Digital IC Design

3-0-0

6

EE 511

Semiconductor Device Modeling

3-0-0

6

EE 515

Semiconductor IC Technology

3-0-0

6

EE 5/6xx

Elective I

3-0-0

6

EE 5/6xx

Elective II

3-0-0

6

EE 512

VLSI Lab I

0-0-4

4

 

 

15-0-4

34

 

Semester II

Code

Course Name

L-T-P

Credit

EE 503

Analog IC Design

3-0-0

6

EE 561

VLSI System Design

3-0-0

6

EE 663

VLSI DSP

3-0-0

6

EE 5/6xx

Elective III

3-0-0

6

EE 513

VLSI Lab II  

0-0-4

4

EE 514

VLSI Lab III

0-0-4

4

 

 

12-0-8

32

Semester III

Code

Course Name

L-T-P

Credit

EE 698

Project Phase I

0-0-24

24

Semester IV

Code

Course Name

L-T-P

Credit

EE 699

Project Phase II

0-0-24

24

 

Credits: Course – 66, Project – 48, Total – 114

 

Syllabi for M.Tech (VLSI)

 

 

EE 510                        Semiconductor Device Modeling                      (3-0-0-6)

 

Preamble:

 

From computers to communications to internet and video games semiconductor devices and the technologies have enabled and expanded human experience in a way that is unique in history. Semiconductor devices have exploited materials, physics and imaginative applications to spawn new lifestyles. The purpose of this course is to give the concepts of semiconductor and compound semiconductor devices in depth. This is important for the device engineers.

 

Course Contents:

 

p-n Junctions: equilibrium conditions, forward and reverse-biased junctions, reverse-bias breakdown, transient and a-c conditions, recombination and generation in the transition, semiconductor heterojunctions, Metal-semiconductor junctions: Schottky barriers, rectifying and Ohmic contacts, Bipolar junction transistors: minority carrier distribution and terminal currents, generalized biasing, switching, secondary effects, frequency limitations of transistors, heterojunction bipolar transistors, Field-Effect Transistors: JFET- current-voltage characteristics, effects in real devices, high-frequency and high-speed issues, Metal Insulator Semiconductor FET, MOSFET- basic operation and fabrication; ideal MOS capacitor; effects of real surfaces; threshold voltages; output and transfer characteristics of MOSFET, short channel and Narrow width effects, MOSFET scaling, Optoelectronics Devices: Light emitting diodes, Lasers, Photoconductors, Junction Photodiodes, Avalanche Photodiodes, Solar Cells, SPICE Models for Semiconductor Devices: MOSFET Level 1, Level 2 and level 3 model, Model parameters; SPICE models of p-n diode and BJT.

 

Texts / References:

 

  1. B. G. Streetman and S. Banerjee, Solid State Electronic Devices, 6th Edition, PHI Private Limited, 2011.
  2. P. Bhattacharya, Semiconductor Optoelectronics Devices, 2nd Edition, PHI, 2009.
  3. G. Massobrio and P. Antognetti, Semiconductor Device Modeling with SPICE, 2nd Edition, TMH, 2010.
  4. C. C. Hu, Modern Semiconductor Devices for Integrated Circuits, Pearson Education, 2010.
  5. R. S. Muller and T. I. Kamins, Device Electronics for Integrated Circuits, 3rd Edition, Wiley India, 2009.

 

  1. S. M. Sze and K. K. Ng, Physics of Semiconductor Devices, 3rd Edition, Wiley India, 2010.
  2. Y. Tsividis, Operation and Modeling of the MOS transistor, 2nd Edition, TMH, 1999.
  3. S. A. Neamen and D. Biswas, Semiconductor Physics and Devices, 4th Edition, TMH, 2012.

 

 

EE 515                       Semiconductor IC Technology                       (3-0-0-6)

 

Preamble:

 

To provide an overview for semiconductor device fabrication engineers of the steps and processes required to make integrated circuits from blank silicon wafers. A course in VLSI semiconductor devices, modern CMOS technology, crystal growth, fabrication and basic properties of silicon wafers. It will focus on lithography, thermal oxidation, Si/SiO2 interface, dopant diffusion, ion implantation, thin film deposition, etching, and back-end technology.

 

Course Contents:

 

Historical perspective, processing overview, crystal growth, wafer fabrication and basic properties of Silicon Wafers, Clean Rooms, Wafer Cleaning, Epitaxy, Thermal Oxidation of Silicon, Lithography, Wet and Dry Etching, Thin film deposition, Diffusion, Ion Implantation, Metallization, Process Integration: Passive components, Bipolar Technology, MOSFET Technology, MESFET Technology, MEMS Technology, IC Manufacturing: Electrical Testing, Packaging, Yield, Future trends and Challenges: Challenges for integration, system on chip.

 

Texts / References:

 

  1. G. S. May and S. M. Sze, Fundamentals of Semiconductor Fabrication, Wiley India, 2004.
  2. J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology, Fundamentals, Practice and Modeling, Pearson education, 2000.
  3. S. M. Sze, VLSI Technology, 2nd Edn., TMH, 2004.
  4. S. M. Sze, Semiconductor Devices: Physics and Technology, 2nd Edn., Wiley India, 2011.
  5. W. R. Runyan and K. E. Bean, Semiconductor Integrated Circuit Processing Technology, Addison Wesley Publishing Company, 1990.
  6. S. A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, 1996.
  7. M. J. Madou, Fundamentals of Microfabrication, 2nd Edition, CRC Press, 2011.

 

 

EE 512                                                VLSI Lab I                           (0-0-4-4)

 

Course Contents:

 

Experiments are based on the following topics: Model Parameter extraction for a diode and MOSFET; NMOS and PMOS characteristics; Inverter characteristics; layout of resistors, capacitors, transistors and inverter; 1-bit Shift Register; digital logic cells; adders; multipliers; Ring Oscillator

 

Texts/References:

 

  1. M. H. Rashid, Introduction to PSpice Using OrCAD for Circuits and Electronics, 3rd Edition, Prentice-Hall India, 2006.
  2. Charles H Roth Jr., Digital Systems Design Using VHDL, 8th Indian reprint, Thomson Learning Inc., 2006.
  3. J. M. Rabaey, A. Chandrakasan and B. Nikolic, Digital Integrated Circuits- A Design Perspective, 2nd Edition, PHI, 2003.
  4. N. H. E. Weste and K. Eshraghian, Principles of CMOS VLSI Design: A Systems Perspective, Pearson Education, 2004.
  5. Mentor Graphics CAD software manuals.

 

 

EE 513                                            VLSI Lab II                            (0-0-4-4)

 

 

Course Contents:

 

Experiments are based on the following topics: NMOS and PMOS characteristics; Common source amplifiers; Layout of resistors, capacitors, transistors; differential amplifier; cascode amplifier; current mirror; push pull CS amplifier; negative feedback amplifier; multistage amplifiers; operational amplifiers and comparators

 

Texts/References:

 

  1. M. H. Rashid, Introduction to PSpice Using OrCAD for Circuits and Electronics, 3rd Edition, Prentice-Hall India, 2006.
  2. B. Razavi, Design of Analog CMOS Integrated Circuits, McGraw Hill, 2001.
  3. B. Razavi, RF Microelectronics, Prentice-Hall, 1998.
  4. P. E. Allen and D. R. Holberg, CMOS Analog Circuit Design, 2nd Edition, Oxford University Press, 1997.
  5. D. A. Johns and K. Martin, Analog Integrated Circuit Design, Wiley Student Edition, 2002.
  6. P. R. Gray and R. G. Meyer, Analysis and Design of Analog Integrated Circuits, 4th Edition, Wiley Student Edition, 2001.
  7. Mentor Graphics CAD software manuals.

 

 

EE 514                                           VLSI Lab III                            (0-0-4-4)

 

Course Contents:

 

Experiments/Projects are based on the following topics: RF front-end: LNA, Mixer, VCO, Frequency Synthesizer, Power Amplifiers and Filters; ADCs, DACs and Digital Compensation techniques; base band designs: Filters, FFT, DCT, Channel coders and Decoders - Viterbi, Reed Solomon, Turbo Codes; Modulation, Synchronization and Timing Recovery Circuits; Image/Video compression techniques.

 

Texts/References:

 

  1. B. Razavi, RF Microelectronics, Prentice-Hall, 1998.
  2. P. E. Allen and D. R. Holberg, CMOS Analog Circuit Design, 2nd Edition, Oxford University Press, 1997.
  3. B. Leung, VLSI for Wireless Communication, Person Education, 2002.
  4. R. J. Plassche, CMOS Integrated Analog-to-Digital and Digital-to-Analog Converters, John Wiley & Sons, Inc., 2004.
  5. F. Horlin and A. Bourdoux, Digital Compensation for Analog Front-Ends: A New Approach to Wireless Transceiver Design, John Wiley & Sons Inc., 2008.
  6. K. K. Parhi, VLSI Digital Signal Processing: Systems, Design and Implementation, Wiley Interscience, 2007.
  7. E. C. Ifeachor and B. W. Jervis, Digital Signal Processing – A Practical Approach, 2nd Edition, Pearson Education, 2002.
  8. B. Sklar, Digital Communications, Pearson Education, 2001
  9. Mentor Graphics CAD software manuals.

 

 

LIST OF ELECTIVES FOR MTECH (VLSI)

 

Electives

Code

Course Name

L–T-P

Credit

EE 562

Fundamentals of VLSI CAD

3-0-0

6

EE 621

Advanced Topics in Random Processes

3-0-0

6

EE 623

Advanced Topics in Signal Processing

3-0-0

6

EE 624

Image Processing

3-0-0

6

EE 625

Computer Vision

3-0-0

6

EE 626

Biomedical Signal Processing

3-0-0

6

EE 627

Speech Signal Processing and Coding

3-0-0

6

EE 628

Speech Technology

3-0-0

6

EE 632

Mobile Communications

3-0-0

6

EE 633

Queuing Systems

3-0-0

6

EE 635

Advanced Topics in Communication Systems

3-0-0

6

EE 636

Detection and Estimation Theory

3-0-0

6

EE 637

Error Control Codes

3-0-0

6

EE 638

Multimedia Security: Methodologies for Content Access Control, Tracking and Authentication

3-0-0

6

EE 639

Sparse Representations & Compressive Sensing: Theory & Applications

3-0-0

6

 

EE 651

Multivariable Control Theory

3-0-0

6

 

EE 653

Nonlinear  Systems and  Control

3-0-0

6

 

EE 657

Pattern Recognition and Machine Learning

3-0-0

6

 

EE 659

Modeling and Simulation of Dynamic Systems

3-0-0

6

 

EE 672

Intelligent Sensor and Actuator

3-0-0

6

 

EE 673

Synchrophasor  Technology

3-0-0

6

 

EE 674

High Voltage Transmission

3-0-0

6

 

EE 680

Electric and Hybrid vehicles

3-0-0

6

 

EE 682

Advanced Electric Drives

3-0-0

6

 

EE 684

Numerical Methods in Electromagnetics

3-0-0

6

 

EE 685

Generalized Theory of Electrical Machines

3-0-0

6