Smart Wearable Advanced Nano Sensing Technologies in Healthcare ASICs
FACILITIES
Facilities
This equipment is mainly used for surface patterning of organic and inorganic material
AFM is used for imaging a sample and to measure surface potential, morphology, electrical properties and etc. of different type samples.
Electrospinning is a highly versatile method to process solutions or melts, mainly of polymers, into continuous fibers with diameters ranging from a few micrometers to a few nanometers.
The equipment is used for four probe temperature controlled DC characterization equipment for measurement of IV characteristics of semiconductor devices.
The equipment is used for Dry and Wet Oxidation process for growing oxide layers of various thickness on the surface of silicon wafers. This is also used for Boron and Phosphorous Diffusion process for doping.
This equipment is mainly used for prepare masks for microscale patterns.
The equipment is used for Imaging, Z-stack, Airyscan mode imaging, Spectra analysis, Live cell imaging, Bleaching experiments and FCS can be done using confocal microscope.
To develop thin films applied to a wide range of domains, from sensors and electrodes used in biomedical and energy sectors to thermo-optical applications in aerospace domains
This equipment helps in high precision single and double sided alignment. It also aids in wafer-to-wafer alignment for wafer bonding applications.
Field Emission Scanning Electron Microscope (FESEM) is a microscope that works with electrons (particles with a negative charge) instead of light. It is used to visualize very small topographic details on the surface or entire or fractioned objects.
To develop thin films applied to a wide range of domains, from sensors and electrodes used in biomedical and energy sectors to thermo-optical applications in aerospace domains
Femtosecond pulse LASER machining device for micro-patterning on material surfaces
The equipment is used for Dry and Wet Oxidation process for growing oxide layers of various thickness on the surface of silicon wafers. This is also used for Boron and Phosphorous Diffusion process for doping.