PECVD

Model:

PECVD, or Plasma-Enhanced Chemical Vapor Deposition, is a process used in semiconductor manufacturing to deposit thin films of various materials onto a substrate.

Electro Spinning Device

Model: Super ES-2

Electrospinning is a highly versatile method to process solutions or melts, mainly of polymers, into continuous fibers with diameters ranging from a few micrometers to a few nanometers.

RIE

Model: EVG620NT

Reactive Ion Etching is a dry etching process used in semiconductor manufacturing and microfabrication to precisely pattern and etch thin films on substrates using a combination of plasma and reactive gases. RIE is highly selective and allows for fine control over etching depth and profile, making it essential for creating high-resolution features in integrated circuits and microdevices.

RF Magetron Sputtering

Model: QPREP400

To develop thin films applied to a wide range of domains, from sensors and electrodes used in biomedical and energy sectors to thermo-optical applications in aerospace domains

Thermal evaporator

Model:

The equipment is used for Dry and Wet Oxidation process for growing oxide layers of various thickness on the surface of silicon wafers. This is also used for Boron and Phosphorous Diffusion process for doping.

Laser Micro-Machining

Model: Clark MXR Inc,Impulse Laser

It's a precise material processing technique that uses a laser to cut, drill, or engrave materials with high precision.Femtosecond pulse LASER machining device for micro-patterning on material surfaces.