dakshgurukul@iitg.ac.in
+91-9395618834
(Time: 10:00 am to 5:30 pm, Monday to Friday)
(Time: 10:00 am to 5:30 pm, Monday to Friday)
The Advanced Certification in IC Packaging and Manufacturing (offered in collaboration with Siemens) is designed to provide a comprehensive understanding of the fundamentals and advanced concepts in IC packaging and semiconductor manufacturing. This course equips learners with the necessary skills to design, analyze, and optimize electronic circuits, semiconductor fabrication processes, and IC packaging technologies.
The curriculum covers:
✅ Basics of Electronics – Understanding circuit design, troubleshooting, and verification techniques for both DC and AC circuits.
✅ Analog Circuit Design – Designing and simulating analog circuits while optimizing frequency response, voltage regulation, and noise performance.
✅ Digital Electronics – Learning digital circuit principles, logic gates, system design, and troubleshooting digital components.
✅ VLSI Fabrication & Technology – Gaining expertise in semiconductor materials, fabrication techniques, and advanced process technologies such as FinFET and 3D integration.
✅ IC Packaging & Flip-Chip Design – Mastering IC package design, estimating parasitics, and utilizing Siemens IC packaging solutions for real-world applications.
With hands-on experience and industry-relevant tools, this program prepares professionals to excel in the rapidly evolving semiconductor and electronics manufacturing industry.
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Daksh Gurukul,1st Floor,
Technology Complex
Indian Institute of Technology Guwahati
Guwahati, Assam-781039
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